High Bandwidth Memory Is Key to China’s AI Ambition
Navigating AI, HBM, and the Semiconductor Trade War
Explore how high-bandwidth memory (HBM) is pivotal to China's AI ambitions and the global semiconductor trade, with insights into the impact of U.S. trade restrictions and future market shifts.
In our latest analysis, we explore the intersection of artificial intelligence (AI), advanced packaging, and the ongoing trade tensions between the United States and China. AI's demand for high-performance hardware, particularly high-bandwidth memory (HBM), is now caught in the crossfire of global trade restrictions. While these sanctions don't directly target advanced packaging, they significantly impact the production and supply of HBM—a critical component for AI training hardware.
The U.S. is considering new measures to limit China's access to HBM, with potential repercussions for the global semiconductor market. Currently, three major suppliers—SK hynix, Samsung, and Micron—dominate HBM production, with SK hynix leading the market. The report delves into the challenges posed by these potential restrictions and examines how China might develop its own HBM supply chain in response.
As the trade war evolves, the semiconductor industry faces unprecedented challenges and opportunities. Our analysis highlights the crucial role advanced packaging technologies play in shaping the future of AI hardware and the broader semiconductor market.
Stay informed on these critical developments with our Advanced Packaging Technology Roadmap and comprehensive technical reports.
