Chiplets and Advanced Packaging: Moving the Industry Forward

In a recent Fireside Chat, Chiplets and Advanced Packaging: Moving the Industry Forward, TechInsights' Advanced Packaging experts, including Adrienne Downey, Markley Research Analyst; Cameron McKnight-MacNeil, Process Analyst; and moderated by Ray Fontaine, Director of Reverse Engineering Product, delved into the critical role of chiplets in the rapidly evolving semiconductor industry. The discussion covered key topics such as the definition of chiplets, their relationship with advanced packaging, and their increasing importance in the booming AI sector.

The conversation also explored the industry leaders in chiplets, the impact of US sanctions on the chiplet landscape, and future trends in this space. Our experts provided valuable insights into how TechInsights is tracking and analyzing these crucial developments.

To view a list of all the content Ray, Cameron and Adrienne mentioned during their presentation, click here.