Summary – WUQi Micro WQ7036AX BT 5.3 LE Audio SoC Floorplan Analysis

Summary – WUQi Micro WQ7036AX BT 5.3 LE Audio SoC Floorplan Analysis

 
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This report presents a Basic Floorplan Analysis of the WUQI Microelectronics ID2 die found inside WUQI Microelectronics WQ7036AX component. The WUQI Microelectronics WQ7036AX component was extracted from the Huawei Eyewear 2 smart glasses. With dual-device connectivity, IP54-rated water resistivity, and smart touch controls, Huawei Eyewear 2 smart glasses was released in May 2024. A deep dive teardown of the Huawei Eyewear 2 smart glasses downstream product is available on TechInsights platform (DDT-2312-808). It is also noteworthy that the Huawei Freeclip T0017C wireless earbuds device also contains two WUQI Microelectronics WQ7036AX components (see DDT-2402-810). The WUQI Microelectronics WQ7036AX device is positioned as Bluetooth/BLE 5.3 dual protocol stack, BLE Audio and LC3 codec, hybrid (FF+FB) ANC, with depth noise reduction capability in high bandwidth.

The information contained in this report is relevant to:

  • RF and mmWave IC Designers: Understand and compare between foundries how a given RF design with Bluetooth functionality translates into a fabricated die.
  • Foundries: Compare, calibrate, and troubleshoot RF technologies and processes for mobile applications.
  • Chip Materials Suppliers: Keep track of substrates and requirements for RF dies with Bluetooth functionality used in applications.
  • Capital Equipment Suppliers: Understand technology requirements for RF devices for mobile applications.

 

Read the executive summary

 

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