Deep Dive Teardown of the Huawei Pura 70 Pro HBN-AL00 Smartphone

Deep Dive Teardown of the Huawei Pura 70 Pro HBN-AL00 Smartphone

 
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The PCB design of the Huawei Pura 70 Pro (HBN-AL00) consists of eleven substrates but only two of them (Main Board and RF Board) are mostly used for RF communication. Most of the cellular communication is situated on the first side of the RF Board while the whole non-cellular (WiFi/BT/GPS) design is placed on both sides of the Main Board with some minor additions of other cellular chips between them.

On top of the whole RF Block there are 13 WiFi/BT/GPS/Main antennas and two other antenna modules responsible for NFC communication and Wireless Charging capabilities. The Huawei Pura 70 Pro HBN-AL00 Cellular Phone/Handset has a total cost of$478.89. This is about 20% more than the average Cellular Phone/Handset. The Octa-Core HiSilicon Kirin 9010 was made in 7nm process node and cost $74.28. The main frame was made of Aluminum and Plastic using extensive machining process. It cost $13.25 which is almost 35% off all non-electronics parts.

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