STMicroelectronics Ouster OS1 LiDAR SPAD Array Sensor – L3 Chip Process Flow Analysis

STMicroelectronics Ouster OS1 LiDAR SPAD Array Sensor – L3 Chip Process Flow Analysis

 
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The STMicroelectronics Ouster L3 Chip with 10 µm pixel pitch is the third-generation LIDAR chip. It is a stacked back-illuminated direct Time-of-Flight (d-ToF) SPAD sensor, which competes directly with the SONY IMX459. The L3 SPAD chip has many innovations, including hybrid bonding, in die quench resistor, dual DTI pixel isolation, finger capacitor, and diffraction grating.

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