Survey Plus Teardown of the Apple iPhone 15 A2846 Smartphone
Share This Post
The iPhone 15 features the 64-bit ARM based Apple’s A16 Bionic APL1W10 - the hexa-core applications processor, combining two Everest high-performance cores with four Sawtooth energy-efficient cores built on a TSMC 4nm process node die (N4P). It’s an updated version of the A15 Bionic. The iPhone 15 is like the iPhone 15 Plus, the main differences are the size of the battery and screen.
The A16 Bionic APL1W10 processor is enclosed in a BGA-POP package. It is integrated with Micron (MT62F768M64D4CA-031 XT:B) 6 GB Mobile LPDDR5X SDRAM memory. KIOXIA provided a new (KICK5A5) 512 GB 3D TLC NAND Flash.
The iPhone 15 supports WiFi 6 and Bluetooth 5.3 connectivity USI chip (339S01225). The same company is responsible for providing new U2 UWB Module (339M00299) with a 7nm process node TSMC UWB Transceiver For the new model iPhone, Apple uses various ICs, Power management block is presented by several suppliers, as STMicroelectronics and Qualcomm. Both audio ICs (CODEC and audio amplifier) were manufactured in Apple/Cirrus Logic cooperation. Skyworks, Broadcom the most popular RFs ICs The iPhone 15 supports UWB and 5G mmWave technology. Its mmWave module is manufactured by USI manufacturer and includes a five elements antenna array.
