HiSilicon Kirin 9000s Hi36A0 GFCV120 SMIC 7 nm N+2 FinFET Process Digital Floorplan Analysis

HiSilicon Kirin 9000s Hi36A0 GFCV120 SMIC 7 nm N+2 FinFET Process Digital Floorplan Analysis

 
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This is a Digital Floorplan Analysis (DFR) of the Hi36A0 GFCV120 die found inside the HiSilicon Kirin 9000S processor. The HiSilicon Kirin 9000S processor as a variant of the Kirin 9000 chipset, powers the latest flagship 5G smartphone − the Huawei Mate 60 Pro, launched on September 3, 2023. It has markings of Hi36A0 GFCV120, similar to the markings found on earlier Huawei phones released between 2020 and 2021 featuring Kirin 9000 series processors. The Hi36A0 GFCV120 processor die was manufactured by SMIC, using N+2 7 nm finFET high-k metal gate (HKMG) CMOS process.

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