3D NAND – Q2 2023 Update

Chi Lim Tan, Senior Process Analyst and NAND expert with TechInsights, has compiled a quick review of major happenings in the second quarter of 2023. Read about newly available or newly announced products and additional insights into products we have been examining:

• Samsung 236-Layer TLC
• SK hynix 238-Layer TLC
• Solidigm 192-Layer QLC
• KIOXIA/Western Digital 218-Layer TLC/QLC, which will use hybrid bonding – in this case, CMOS directly bonded to array (CBA)
• Micron – further insights into their 232-layer TLC
• YMTC – further insights into their 128-layer QLC
• TEL’s novel chemistry cryo process for memory hole etch

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