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Latest Blogs and Commentary
KIOXIA/WD BiCS8 218L CBA 3D TLC NAND
Discover the latest Hybrid Bonding technology with the KIOXIA/WD BiCS8 CBA 3D TLC NAND. Analyzed by TechInsights, this innovative device showcases an advanced edge-XDEC floor plan and a sophisticated 2-deck integration.
Samsung SF3 (2nd Gen 3nm GAA) in Exynos W1000 Processor Confirmed
Initial SEM results confirm Samsung’s 2nd generation 3nm GAA technology in the Exynos W1000 processor. Discover key insights and implications for high-volume manufacturing requirements in our latest analysis on the TechInsights Platform.
The Chip Insider®– If Trump wins election: The bill for Chip Makers
In this blog, we discuss the potential impact on the semiconductor industry if Trump wins the election, including concerns about U.S. direct investment requirements for foreign chip makers, and Samsung's delay of their Taylor, TX fab following the $6.4 billion CHIPS Act subsidy announcement.
Intel Drops Hyperthreading From New CPU
Intel’s Lion Cove contains significant departures from previous CPU microarchitectures, prioritizing performance efficiency by omitting hyperthreading and other performance-boosting innovations but still manages to deliver a double-digit IPC uplift.
Microprocessor Report June 2024 Review
Microsoft’s Copilot+ PC demands saw Qualcomm, Intel and AMD all launch new PC SoCs with advanced NPUs. Intel’s Gaudi 3 will compete with NVIDIA—although only NVIDIA’s previous generation H100. Advanced packaging is a significant industry trend, and AR is a driving force behind new packaging technologies from TSMC seen in the Apple R1, and an experimental SoC from Meta.
AI's Influence on Advanced Packaging: Mid-Year Briefing Highlights and Innovations
Topics covered include TSMC’s recent announcements of an expanded technology offering for system-on-wafer (SoW) and new targets supporting continued interposer scaling in 2.5D chip-on-wafer-on-substrate (CoWoS) technology that is underpinning the AI boom.
Apple Vision Pro: Revolutionizing Face ID with TrueDepth Technology
Spatial computing integrates a user’s virtual environment with their physical surroundings, and Apple's Vision Pro achieves this with a suite of advanced sensors. While LiDAR, or Light Detection and Ranging, plays a significant role in mapping the user's space, the TrueDepth camera system adds another layer of depth sensing.
Samsung Galaxy Watch 7
Discover the Samsung Galaxy Watch 7 with TechInsights. Explore the latest Exynos W1000 processor, advanced health tracking, AI wellness tools, and our detailed technical analysis.
Samsung Exynos W1000 Processor
Get an in-depth first look at the Samsung Exynos W1000 processor in the Galaxy Watch 7 Series. Discover the 3nm gate-all-around process, critical dimensions, and upcoming detailed analyses on TechInsights.
Sustainability at SEMICON West 2024: Achieving Sustainable Growth in the Semiconductor Industry
SEMICON West recently wrapped up, and one of the notable programs focused on sustainability, which provided a platform for sharing insights, innovative solutions, and collaborative strategies to address environmental challenges.
Taking Monolithic Designs to Disaggregation
The term ‘chiplet’ has come into use to describe an evolved design strategy moving past monolithic system-on-chip (SoC) to the heterogeneous integration of a disaggregated design in a system-in-package (SiP).
Chiplet Technology: Disrupting Chip Design and Fueling Growth
The semiconductor industry is facing a turning point with the rise of chiplet technology (also known as chiplet-based design or semiconductor chiplet technology). This revolutionary approach has been made possible by the advances in chip-to-chip interconnect and is poised to reshape chip production and design, particularly within the computing segment.
America's Chip Suppliers Continue to Dominate R&D Spending
Despite political and national security concerns about US domestic semiconductor production, American companies continue to account for more than half of the global chip industry’s total spending on research and development, according to the latest annual analysis of R&D expenditures by TechInsights.
Lunar Lake Packs Big Efficiency Boost
Intel’s Lunar Lake, the biggest overhaul of its architecture for PC processors since the addition of efficiency cores with Alder Lake, promises a big leap in power efficiency that may nullify AMD’s long-standing advantage in this metric.
Apple R1 Adopts TSMC’s Latest Package
Apple’s R1 sensor hub chip in the Vision Pro AR/VR headset is the first use that TechInsights has seen of TSMC’s InFOM advanced packaging technology. The R1 has a 5nm processor chip plus two LLW DRAMs linked by short very-high-density interconnect to speed up the data processing.
LiDAR Technology in Apple Vision Pro
Spatial computing is a highlight of the new Apple Vision Pro headset. This device uses various sensors to integrate virtual and physical environments by sensing the three-dimensional structure of the user's space and eye movements.
Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
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