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Tracking the market for semiconductors, from the fab floor to the customer’s door.
Latest Blogs and Commentary
Apple iPhone 13 Pro Teardown
We received the iPhone 13 and iPhone 13 Pro in our labs and identification and early costing analysis are available below.
Fitbit Luxe Teardown
Will the Fitbit Charge 5 Outshine the Fitbit Luxe? Stacy Wegner September 9, 2021 We don’t know, and we do not comment on whether one device is better than its previous generation. What we do, is look at and compare generations of devices. And while
Disruptive Technology: TSMC 22ULL eMRAM
TSMC 22ULL eMRAM Die removed from Ambiq™ Apollo4 Another Disruptive Technology on Embedded Memory! Another disruptive product on embedded Memory (eMemory) has been arrived and quickly reviewed! TSMC has successfully developed and commercialized 22 nm
Reverse engineering 5G mmWave technology
Reverse engineering 5G mmWave technology Contributing authors: John Sullivan and Radu Trandafir While 5G is becoming more mainstream, mmWave 5G is still in its infancy. Space and power efficiency are important design considerations for cellular
Intelligent move: Ottawa's TechInsights acquires San Jose-based market research firm VLSI
An Ottawa company that gives global semiconductor giants detailed breakdowns of how their competitors’ technology works has joined forces with a leading Silicon Valley market research firm as it looks to broaden its corporate intelligence skills.
TechInsights and VLSIresearch join forces
Innovation Decisions Accelerated: TechInsights Acquires VLSIresearch TechInsights is pleased to announce the acquisition of VLSI Research Inc., the award-winning provider of market research and economic analysis covering the semiconductor supply
Micron 176L 3D NAND
NAND Memory Technology Micron B47R 3D CTF CuA NAND Die, the World’s First 176L (195T)! Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process
Latest SJ-MOSFET Technology, Can It Still Compete with Wide Bandgap?
Power Semiconductor Technology Latest SJ-MOSFET Technology, Can It Still Compete with Wide Bandgap? Now both silicon carbide (SiC) and gallium nitride (GaN) products are having an impact in the marketplace, it is easy to think that there is no longer
Micron DDR5 DIMM Technology
DRAM Memory Technology Disruptive Product: What technology node for 1st DDR5 DIMM? DDR5 is a new generation of Memory! All the major DRAM players are moving forward to a faster DRAM, DDR5. DDR5 improves power management (1.1V vs. 1.2V for DDR4) as
Micron 1α DRAM Technology
DRAM Memory Technology Micron D1α, '14 nm'! The Most Advanced Node Ever on DRAM! D1α! It’s 14 nm! After a quick view on Micron D1α die (die markings: Z41C) and cell design, it’s the most advanced technology node ever on DRAM. Further, it’s the first
EUV光刻机争夺战，升级！(EUV lithography machine battle, upgrade!)
The battle for EUV lithography machines is gradually intensifying.
How many mini-LEDs did Apple pack into the iPad Pro?
Teardown Technology Stacy Wegner How many mini-LEDs did Apple pack into the iPad Pro? An in-depth look at the Liquid Retina XDR display Note: this article provides an update to the Displays section of our lengthier article on the TechInsights
Intel 2nd Generation XPoint Memory
Embedded and Emerging Memory Technology Here, we have the Intel 2 nd gen. XPoint Memory die! Finally, we’ve found the Intel XPoint TM Memory 2nd generation die! We’ve quickly viewed the die removed from Intel OptaneTM SSD DC P5800X 400GB (Model
Teardown: Apple iPhone 12 Pro Max 5G
Electronics360 News Desk: The following is a partial deep dive into a Teardown of the Apple iPhone 12 Pro Max 5G smartphone conducted by TechInsights.
Apple iPad Pro Teardown
In this year’s iPad Pro, the new 12.9” mini-LED display and new TrueDepth camera system may be taking ‘Center Stage’ for many users, TechInsights will continue to look deeper for other semiconductor and design winners inside the new iPad Pro.
Groundbreaking SenSWIR Sensor by Sony- IMX990/IMX991
This approach presents two advantages, the Cu-Cu DBI can help reduce the overall height of the Die while Die-to-Wafer hybridization can help reduce the per-Die cost, thereby facilitating greater utilization of Sony’s SWIR technology for a wide range of applications. Recently, TechInsights revealed the first detailed cross-sectional image of the 1.34MP.
Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
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