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Teardown: ASUS ROG Rapture GT-AXE11000 router
Teardown: ASUS ROG Rapture GT-AXE11000 router Routers are essential for any internet connections inside the home, whether it be for gaming, work or operating entertainment systems or smart home devices. ASUS has been in the business of creating
Teardown: Lenovo Mirage VR S3 headset
Teardown: Lenovo Mirage VR S3 headset Virtual reality (VR) headsets have taken off in recent years after remaining stagnant due to more content becoming available for users to enjoy both movies, games and other entertainment forms. With the inception
Teardown: Apple Macbook Pro 16
Teardown: Apple Macbook Pro 16 While Apple may be most famous for its handheld internet-enabled devices, its Macbook Pro line has been a steady supply of revenue for the company for many years. The Macbook Pro has been a staple for many corporate IT
Oppo Find X5 Pro improves Anti-Shake Technology with 5 axis image stabilization
Oppo Find X5 Pro improves Anti-Shake Technology with 5 axis image stabilization John Scott-Thomas The Oppo Find X5 Pro was released in March, 2022 and introduce 5 axis optical image stabilization. This allows a putative x3 improvement in anti-shake
Teardown: Samsung Galaxy Z Fold 5G
Teardown: Samsung Galaxy Z Fold 5G Foldable phones, once thought to be a dream, have become a reality. While flip phones were introduced many years ago as one of the first iterations of expanding cell phone form factors, it wasn’t the screen that
Teardown: Lenovo ThinkPad X1 Fold laptop
Teardown: Lenovo ThinkPad X1 Fold laptop Foldable electronics are growing in number but remain a niche market overall. Consumers are interested in the technology but the practicality of using foldable electronics is something that just hasn’t caught
Disruptive Technology: 7nm SMIC MinerVa Bitcoin Miner
TechInsights has discovered what appears to be SMIC 7nm technology in the MinerVa Bitcoin Miner SoC. Learn why this matters and its market impact by downloading our Disruptive Technology Brief today.
Webinar - Recent GaN Innovation, Moving from Consumer to Data Center and Automotive
In this webinar, Dr. Stephen Russell will delve into the innovations found within recently released GaN devices for both low-voltage ( 600 V) devices aimed at data centers and high voltage (>650 V) devices looking to enter the light industrial and even automotive markets.
Upcoming New 3D NAND TLC Devices: Samsung 176L & 238L, SK hynix 176L, KIOXIA/WD 162L
Micron, and now other leading 3D NAND players such as Samsung, SK hynix, KIOIXA, and Western Digital (WD) have finished the risky product stage and just moved onto the high-volume product stage with a higher yield for SSD application. Dr. Jeongdong Choe compares each.
Edwards- Number 1 WFE Subsystems Supplier
Edwards- Number 1 WFE Subsystems Supplier Edwards Awarded 10 BEST Supplier
Disruptive Technology: ROHM Generation 4 SiC MOSFET
New ROHM 4th Generation SiC MOSFETs Featuring the Industry’s Lowest ON Resistance. Download the product brief for more details, and for a high-resolution image showing the trench structure with annotations.
Webinar - Memory Process and Integration Challenges: DRAM & NAND
In this Memory webinar, Dr. Jeongdong Choe gave an overview and discussed the latest memory technology trends and challenges, focusing on DRAM and NAND devices.
Qualcomm RF Front End Expansion: Beyond Smartphones
Having a true end-to-end, modem-to-antenna solution and capitalizing on the benefits of having developed class-leading mobile applications with integrated baseband (BB) processors/modems, there is nothing missing from Qualcomm’s portfolio.
ASML- Only Five Star WFE Leader
ASML- Only Five Star WFE Leader ASML is awarded 10 BEST, THE BEST, and RANKED 1st awards
ASM Pacific Technology- Wins its Sixth Triple Crown
ASM Pacific Technology- Wins its Sixth Triple Crown ASM Pacific Technology Awarded 10 BEST Supplier
Nidec SV TCL- Five Star Partner to Customers
Nidec SV TCL- Five Star Partner to Customers Nidec SV TCL awarded one of THE BEST Suppliers in Test Subsystems
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Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
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