Chip Observer
Tracking the market for semiconductors, from the fab floor to the customer’s door.
Latest Blogs and Commentary
Highlights from the NVIDIA GTC Conference
Discover the latest advancements and insights unveiled by NVIDIA in our blog, keeping you informed on cutting-edge technology and developments in the tech industry.
Unveiling the Logic Advanced Packaging Briefing
Three times a year we curate important updates, supplementary analysis of recent reports, high-level packaging process flows, and sneak peeks at upcoming devices and packaging reports. The result is an Advanced Packaging Analyst’s Briefing, and this year it has a new video format, the first of which is now available on-demand to our subscribers.
The Chip Insider®– Apple’s decision tree for killing its Autonomous Vehicle
By now, you’ve surely read plenty about the quiet canceling of Apple’s Titan AV effort. Most of the focus has been on what it means for Apple. This Chip Insider® steps back to see the darker picture Titan’s fall from grace paints about the future of AVs.
Renesas Presses MCU Performance Lead
With the expansion of the RA8 series, Renesas is integrating Arm’s highest-performing Cortex-M CPU in microcontrollers optimized for graphics display and motor control applications.
NVIDIA Goes All In on Generative AI
NVIDIA's latest unveilings represent a significant leap forward in technological innovation across various domains. The introduction of the Blackwell GPU, while lacking specific performance metrics, hints at enhanced capabilities, especially with its integration into the DRIVE THOR SoC.
Samsung Unveils First Imager Featuring Hybrid Bond Technology
Unlock the future of imaging technology with TechInsights' groundbreaking discovery: Samsung's inaugural imager boasting innovative hybrid bond technology.
3D NAND Technology Roadmap
Gain exclusive access to TechInsights' comprehensive 3D NAND Technology Roadmap, guiding you through the ever-evolving landscape of innovation.
Maximizing NAND Capacity per Wafer in 3D NAND Production
Stay ahead in the dynamic world of semiconductor technology with insights into the race for maximum NAND capacity per wafer in 3D NAND production. Discover how advancements are driving innovation, pushing boundaries, and shaping the future of storage.
Accelerating Automotive Innovation with AI
Discover the groundbreaking Blackwell chip, promising accelerated advancements in autonomous driving and electric vehicles with its impressive performance improvements.
Blackwell Unveiled - A Leap Towards Exascale Compute
Discover Blackwell, NVIDIA's latest GPU chip unveiled at GTC 2024. With unparalleled performance and innovative features, Blackwell sets a new standard for server capabilities, paving the way for exascale computing.
Blackwell Turbocharges NVIDIA's Push into Automotive Cockpits with Generative AI Solutions
Unlock the future of automotive innovation with NVIDIA's generative AI solutions. Integrating Blackwell GPU architecture into the DRIVE THOR SoC, NVIDIA promises advancements in vehicle technology.
Top 10 Smartphone Models
Explore the top 10 smartphone models unveiled at MWC 2024, ranging from sleek flagships to budget-friendly alternatives. Discover groundbreaking innovations and cutting-edge features that redefine the mobile experience.
Reducing Carbon Emissions will be a Challenge for Semiconductor Manufacturers
How do you continue to innovate and produce increasingly more powerful and complex silicon wafers, while simultaneously addressing environmental concerns related to the energy and water needs, as well as the chemical and carbon emissions that are part of the manufacturing process?
Apple Vision Pro Cameras
Unlock the secrets of the Apple Vision Pro camera system with die photos and precise measurements to discover its groundbreaking technology today.
MWC Post Show Video 2: PC Sustainability, Automotive Connectivity, and AI Innovation
Explore exclusive insights from our top analysts at MWC 2024, uncovering this year's pivotal technology trends.
Intel Adds 3D Decaps to Meteor Lake
In the Meteor Lake CPU die, Intel has pushed the capacitance density of on-die capacitors to new heights by taking a page out of DRAM’s book of tricks.
Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
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