This report presents a Memory Functional Analysis of the Micron stacked Z11M LPDDR4X dies found inside the Micron MT53D512M64D4NZ-053 WT:D package-on-package (PoP). The MT53D512M64D4NZ-053 WT:D PoP was extracted from a Huawei Mate 10 smartphone with the model number ALP-AL00.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) cross-sectional micrographs through the bit line (BL) showing the general structure of the DRAM cell array, die dielectric materials, and major features
• SEM bevel through the memory array showing the active, bit, and word line level plan-view features
• Plan-view optical micrograph of the die delayered to the polysilicon layer
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software