Product Code
FAR-1705-801
Release Date
Availability
Published
Product Item Code
SAM-8895
Device Manufacturer
Samsung
Device Type
Applications Processor
Subscription
Compute
Channel
Logic - Digital Floorplan (IP)
Logic - Digital Floorplan
Samsung Exynos 8895 Digital Functional Analysis Report
This report presents a Digital Functional Analysis of the Samsung S5E8895A01 die found inside Samsung Exynos 8895
PoP component. The Exynos 8895 component was extracted from a Samsung Galaxy S8 smartphone with the model number
SM-G950N.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including fin/STI, gate, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to polysilicon
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
 

Make informed business decisions faster and with greater confidence

Start My Free Trial

 

The authoritative information platform to the semiconductor industry.

Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.