Latest Blogs and Commentary
Insight: Smart Home Device Shipments to Exceed 2.5 Billion in 2030
TechInsight’s latest smart home device forecast predicts global shipments of smart home devices will almost double between 2024 and 2030 to exceed 2.5 billion units at the end of this period.
Global xEV Sensor Demand Forecast for 2022–2031
TechInsights forecasts xEV production to grow at a CAAGR of 13%, with volumes reaching 59.2 million units by 2031. Sensor demand from xEV powertrain systems is forecast to grow at a CAAGR of 12% from $0.8 billion in 2023 to $1.4 billion in 2028 and reaching nearly $1.6 billion by 2031.
Deep Dive Teardown of the Amazon Alexa Echo Hub G6A87E Smart Display
The Amazon Alexa Echo Hub G6A87E is an Alexa controlled device with a display/touchscreen, four microphones, and two speakers. The speakers are located at the top of the device. The Amazon Alexa Echo Hub G6A87E has 2 GB LPDDR4 SDRAM, 8 GB MLC NAND Flash Memory and the 64-Bit Hexa-Core application processor from MediaTek.
Advanced Processing and Structures for Device Performance Boost in EPC2619 E-Mode Sixth Generation GaN HEMT
Efficient Power Conversion (EPC)’s EPC2619 E-Mode Sixth Generation GaN HEMT boasts improved device performance over EPC’s previous generation device and shows very competitive figures compared to other 100 V GaN HEMT devices. This blog discusses processing techniques and structures observed that can contribute to the device performance boost.
Omnivision OX08D10 Standard Floorplan Analysis
This report provides an insight into the structure of the OmniVision OX08D10 CMOS image sensor ISP die for automotive applications. The analysis provides foundry identification and a summary of the salient features observed that is accompanied by a set of SEM cross-section of the ISP die.
Ryzen AI 300 Claims Lead in PC TOPS
AMD’s Strix Point processors integrate an NPU capable of 50 TOPS with the new Zen 5 CPU capable of 16% better IPC and an upgraded GPU.
xEV Global Semiconductor Demand Outlook 2022-2031
TechInsights forecasts xEV production to grow at a CAAGR of 13%, with volumes reaching 59.2 million units by 2031. Semiconductor demand from xEV powertrain systems is forecast to grow at a CAAGR of 15% from $10.5 billion in 2023 to almost $21.4 billion in 2028 and reaching $25.6 billion by 2031.
AI drives server market growth to $270b by 2028
TechInsights predicts the server market will reach $273b by 2028, growing at a CAGR of 18%. Unlike recent years where server demand has been cyclical in nature and effected by the ebb and flow of refresh cycles, now a disruptive influence is stimulating growth: artificial intelligence.
Global Smartphone Installed Base Forecast by Operating Systems for 88 Countries: 2007 to 2029
TechInsights smartphone research team predicts global smartphone installed base will grow 2% YoY in 2024 and 2025. The growth rate will be modestly improved from 2026 through 2029 driven by technology innovations and the penetration of on-device AI smartphones. Android and Apple are expected to retain market leadership with shares of 82% and 16% in 2024, respectively.
Insight: Renesas RoX Development Platform to “shift left” SDV Deployment
Renesas launched its R-Car Open Access (RoX) development platform for software-defined vehicles (SDVs). Designed for the Renesas R-Car family of system on chips (SoCs) and microcontrollers (MCUs), the aim is to help Renesas’ OEM and Tier 1 customers to “shift left” their respective developments of software defined vehicle (SDV) platforms that will be underscored by the move towards battery electric vehicles (BEVs).
Smartphone Memory Market Share Q1 2024: Revenue Grows Over 50% YoY, SK Hynix Gains Share
The global smartphone memory market experienced over 50 percent revenue growth in Q1 2024. The annual growth was backed by the recovery in pricing and inventory build-up demand from major smartphone customers. Samsung recorded 49 percent revenue share followed by SK Hynix and Micron in Q1 2024. This report covers the global shipments, revenue, and ASP of NAND Flash and DRAM Memory chip products by vendor, by technology and by quarter from CY2018Q1 to CY2024Q1.
Tracker: Global Foldable Smartphone Revenue and ASP by Vendor : Q1 2024
Huawei leads the foldable markets in Q1 2024. Huawei is at the peak position in both shipments and revenues. Huawei in on route to become the largest foldable vendor. Asia-Pacific is a growth leader in foldable-display smartphone shipments.
Tracker: Global Foldable Smartphone Shipments Forecast by Vendor by Region by Quarter to 2025
Samsung's share is eroding and it will lose peak position in 2024 to Huawei. We forecast Samsung will retain second place globally still in 2025 followed by Honor taking third position.
Omnivision OX08D10 Device Essentials Folder
This report provides an overview into the structure of the OmniVision OX08D10 CMOS image sensor (CIS). The analysis provides foundry identification and details of the fabrication process used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed, and is accompanied by a set of optical, SEM cross-section, and bevel images of both CIS and ISP dies.
Deep Dive Teardown of the Huawei Pura 70 Pro HBN-AL00 Smartphone
The PCB design of the Huawei Pura 70 Pro (HBN-AL00) consists of eleven substrates but only two of them (Main Board and RF Board) are mostly used for RF communication. Most of the cellular communication is situated on the first side of the RF Board while the whole non-cellular (WiFi/BT/GPS) design is placed on both sides of the Main Board with some minor additions of other cellular chips between them.
AMD Ryzen 9 7950X3D (TSMC 5nm HPC) Process Flow Analysis
Analysis of the process flow and integration used in the manufacture of the AMD Ryzen 9 7950X3D compute die (CCD), built using TSMC's N5 HPC FinFET process. The spreadsheet lists the hundreds of process flow steps required in its manufacture.
Deep Dive Teardown of the ZTE Nubia Z60 Ultra NX721J Smartphone
In the ZTE Nubia Z60 Ultra NX721J TechInsights found the following for the first time: Multichip Memory -16 GB Mobile LPDDR5X SDRAM Samsung #K3KL5L50CM-BGCW, Power Management Qualcomm #PM8550B-001, Camera Power Management Qualcomm #PM8010-1U4, HB/MB Front-End Module Qorvo #QM77058F.
June McClean Report 2024
The June Update to The McClean Report examines semiconductor industry research and development trends. An overview of R&D spending is followed by a review of investment growth since the 1990s, R&D expenditures as a percent of annual sales, a ranking of top R&D spenders, and regional trends in R&D spending.