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TechInsights Acquires The Linley Group to Further Expand Its Platform of Semiconductor Content

TechInsights Acquires The Linley Group to Further Expand Its Platform of Semiconductor Content

TechInsights Acquires The Linley Group to Further Expand Its Platform of Semiconductor Content OTTAWA, ON, October 14, 2021 - TechInsights Inc. is pleased to announce the acquisition of The Linley Group, Inc., an industry-leading source for
October 14, 2021 Oct 14
 YMTC 128L 3D Xtacking 2.0 TLC NAND

YMTC 128L 3D Xtacking 2.0 TLC NAND

YMTC 128L Xtacking 2.0 for SSD! Finally, they might catch up with Samsung, SK hynix, and KIOXIA Dr. Jeongdong Choe September 23, 2021 TechInsights just found and quickly reviewed YMTC 128L TLC die removed from Asgard Memory (Powev Electronic
September 23, 2021 Sep 23
Apple iPhone 13 Pro Teardown

Apple iPhone 13 Pro Teardown

We received the iPhone 13 and iPhone 13 Pro in our labs and identification and early costing analysis are available below.
September 23, 2021 Sep 23
Fitbit Luxe Teardown

Fitbit Luxe Teardown

Will the Fitbit Charge 5 Outshine the Fitbit Luxe? Stacy Wegner September 9, 2021 We don’t know, and we do not comment on whether one device is better than its previous generation. What we do, is look at and compare generations of devices. And while
September 09, 2021 Sep 9
Disruptive Technology: TSMC 22ULL eMRAM

Disruptive Technology: TSMC 22ULL eMRAM

TSMC 22ULL eMRAM Die removed from Ambiq™ Apollo4 Another Disruptive Technology on Embedded Memory! Another disruptive product on embedded Memory (eMemory) has been arrived and quickly reviewed! TSMC has successfully developed and commercialized 22 nm
August 26, 2021 Aug 26
Micron 176L 3D NAND

Micron 176L 3D NAND

NAND Memory Technology Micron B47R 3D CTF CuA NAND Die, the World’s First 176L (195T)! Micron’s 176L 3D NAND is the world’s first 176L 3D NAND Flash memory. TechInsights just found the 512Gb 176L die (B47R die markings) and quickly viewed its process
August 13, 2021 Aug 13
Latest SJ-MOSFET Technology

Latest SJ-MOSFET Technology, Can It Still Compete with Wide Bandgap?

Power Semiconductor Technology Latest SJ-MOSFET Technology, Can It Still Compete with Wide Bandgap? Now both silicon carbide (SiC) and gallium nitride (GaN) products are having an impact in the marketplace, it is easy to think that there is no longer
August 06, 2021 Aug 6
Micron DDR5 DIMM Technology

Micron DDR5 DIMM Technology

DRAM Memory Technology Disruptive Product: What technology node for 1st DDR5 DIMM? DDR5 is a new generation of Memory! All the major DRAM players are moving forward to a faster DRAM, DDR5. DDR5 improves power management (1.1V vs. 1.2V for DDR4) as
July 29, 2021 Jul 29
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Micron 1α DRAM Technology

DRAM Memory Technology Micron D1α, '14 nm'! The Most Advanced Node Ever on DRAM! D1α! It’s 14 nm! After a quick view on Micron D1α die (die markings: Z41C) and cell design, it’s the most advanced technology node ever on DRAM. Further, it’s the first
July 08, 2021 Jul 8
iPad Pro Displays

How many mini-LEDs did Apple pack into the iPad Pro?

Teardown Technology Stacy Wegner How many mini-LEDs did Apple pack into the iPad Pro? An in-depth look at the Liquid Retina XDR display Note: this article provides an update to the Displays section of our lengthier article on the TechInsights
June 28, 2021 Jun 28
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Intel 2nd Generation XPoint Memory

Embedded and Emerging Memory Technology Here, we have the Intel 2 nd gen. XPoint Memory die! Finally, we’ve found the Intel XPoint TM Memory 2nd generation die! We’ve quickly viewed the die removed from Intel OptaneTM SSD DC P5800X 400GB (Model
June 03, 2021 Jun 3
iPad Pro Teardown

Apple iPad Pro Teardown

In this year’s iPad Pro, the new 12.9” mini-LED display and new TrueDepth camera system may be taking ‘Center Stage’ for many users, TechInsights will continue to look deeper for other semiconductor and design winners inside the new iPad Pro.
May 24, 2021 May 24
Sony IMX990

Groundbreaking SenSWIR Sensor by Sony- IMX990/IMX991

This approach presents two advantages, the Cu-Cu DBI can help reduce the overall height of the Die while Die-to-Wafer hybridization can help reduce the per-Die cost, thereby facilitating greater utilization of Sony’s SWIR technology for a wide range of applications. Recently, TechInsights revealed the first detailed cross-sectional image of the 1.34MP.
May 19, 2021 May 19
Apple Homepod Mini Teardown

Apple Homepod Mini Teardown

May 5, 2021 Teardown Technology A quick look inside the Apple Homepod Mini design wins, but is there a secret part waiting to be intialized? The Apple HomePod Mini A2374 is a voice-interactive smart speaker with Siri assistant. It features four
May 05, 2021 May 5
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Intel's 2nd Generation XPoint Memory

April 30, 2021 Dr. Jeongdong Choe Intel's 2 nd Generation XPoint Memory - Will it be worth the long wait ahead? In 2017, TechInsights analyzed the details on Intel 1 st gen. XPoint Memory (Optane TM Memory 16GB, MEMPEK1W016GA) including structure
April 30, 2021 Apr 30
Qualcomm extends their mmWave leadership position

Qualcomm extends their mmWave leadership position

April 21, 2021 Kyle Nolan Qualcomm extends their mmWave leadership position 5G mmWave is still far from worldwide adoption but Qualcomm is keeping their foot on the pedal despite no one really close on their tail. One of Qualcomm’s Sr. Directors of
April 21, 2021 Apr 21

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