Our subscription-based service gives you 24/7 online access to channel specific reports, images, supply chain relationships, and more, revealing the inner workings and secrets of innovative technologies, form factors, and feature sets. Using the most advanced reverse-engineering and technical analysis capabilities in the world our data provides:
Details on how the product is built
Innovative design features and supply chain relationships
In-depth cost estimate of the bill of materials (BOM) included
Our Value
By revealing the innovation others can’t inside advanced technology, we prove patent value and drive the best IP and technology investment decisions.
Technical and product teams for the world’s most innovative and disruptive technology companies use our insights to make the best technology investment decisions.
By combining deep patent knowledge with the most advanced reverse engineering and technical analysis capabilities in the world we have demonstrated an unrivaled ability to match patents to products and deliver solid evidence of use in advance technology markets.
Depth and Breadth of Analysis
TechInsights analyses thousands of devices each year, from system level, right through to the silicon.
- Teardown and analyze 750+ products
- Catalogue 6,500+ components
- Analyze 2,000+ chips per year
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Apple iPhone Air A3260 Teardown: Cost and Component Insights
TechInsights’ teardown of the Apple iPhone Air A3260 reveals 29 new components, a BOM cost 2% higher than Samsung’s S25 Edge, and key cost drivers in silicon and RF.
Get a data-driven view of the technologies, markets, and supply-chain dynamics that will define 2026 and beyond.
AI demand fuels DRAM and NAND shortages, major chip mergers, and new SoC breakthroughs. Read TechInsights’ November Chip Observer for full semiconductor analysis.
The Authoritative Information Platform to the Semiconductor Industry.
