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Apple iPhone Air A3260 Teardown: Cost and Component Insights
TechInsights’ teardown of the Apple iPhone Air A3260 reveals 29 new components, a BOM cost 2% higher than Samsung’s S25 Edge, and key cost drivers in silicon and RF.
Get a data-driven view of the technologies, markets, and supply-chain dynamics that will define 2026 and beyond.
AI demand fuels DRAM and NAND shortages, major chip mergers, and new SoC breakthroughs. Read TechInsights’ November Chip Observer for full semiconductor analysis.
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