Latest Blogs and Commentary
TSMC vs. Fujitsu: A Brief Comparison of 22ULL Embedded ReRAM Technologies
STT-MRAM and ReRAM are leading the charge in the evolution of memory technology, with significant advancements being made in these areas. Both are increasingly used in automotive, IoT, and other high-growth applications, surpassing older memory technologies like FeRAM and PCRAM.
Qualcomm's New Mobile Chipset: Making 5G Affordable by Reducing BOM Costs
At MWC2024, Qualcomm announced a groundbreaking development: 5G smartphones priced at $99 and below. Since 5G's debut in 2019, high costs have hindered widespread adoption, with prices rarely falling below $200. The Snapdragon 4s Gen 2 aims to change that by offering cost-optimized technologies.
Smartphone Market Grows 8% in Q2 2024: Emerging Markets Lead Recovery
The global smartphone market grew 7.6% year-over-year in Q2 2024, reaching 289.6 million units. This marks the third consecutive quarter of recovery, driven by strong demand in emerging markets like Africa, Latin America, and Asia-Pacific.
The Chip Insider®– China's 3rd Plenum: What it means for the Chip War
China's 3rd Plenum reveals new economic policies and technology goals, impacting the ongoing Chip War. Discover how this meeting will influence China's semiconductor strategy and its bid for tech independence.
WELION's Semi-Solid-State Batteries: Transforming EVs and Small Power Products
NIO, the Chinese electric vehicle manufacturer, recently tested its new semi-solid-state batteries during a 14-hour, 650-mile journey with CEO William Li driving the ET7 sedan. These batteries, developed by Chinese company WELION, boast a 150-kWh capacity, promising extended range and faster charging times.
Skymont Targets P-Core Parity
Intel’s Skymont CPU represents a significant evolution of the company’s efficiency cores from the origins of the Atom low-power core to something much closer in performance-per-clock to the company’s recent flagship performance cores.
The Chip Insider®– Soft Landing or Hard Landing?
Explore the potential impact of economic tightening on the semiconductor industry as chip stocks signal a hard landing. Understand the importance of equipment content rates, utilization, and silicon production to navigate the industry's rough seas and prepare for future challenges.
Battery Breakthroughs in EVs: Chevy Bolt, Tesla Models, and Hyundai IONIQ 5
The electric vehicle (EV) market is rapidly expanding, with millions of new electric cars registered globally, bringing the total on the roads to tens of millions.
Exploring Apple Vision Pro’s Revolutionary Eye Tracking System
In our series on Apple Vision Pro, we now focus on the headset's eye tracking system. This advanced technology allows users to control the interface with their gaze, replacing traditional input methods like a mouse or trackpad.
TDK CeraCharge™ - the First Rechargeable all-Ceramic SMD Battery
TDK CeraCharge™ - the First Rechargeable all-Ceramic SMD Battery Discover the advancements in IoT power sources with TDK CeraCharge™, the first rechargeable all-ceramic solid-state SMT battery. Learn about its innovative materials, performance
Syntiant’s NDP250 Boosts Memory
Explore Syntiant’s new chip that handles larger models than competition, and offers advanced vision and voice interfaces.
Chiplets Moving Into the Fast Lane: Transforming Automotive Processors
Chiplets moving into the Fast Lane: Transforming Automotive Processors Discover how chiplet technology is transforming the automotive industry, offering higher yields, faster development, and reduced costs. TechInsights predicts significant chiplet
Smart Home Device Shipments to Exceed 2.5 Billion in 2030
Discover how the smart home device market is set to exceed 2.5 billion shipments by 2030. Learn about the key drivers, regional insights, and strategic opportunities that will shape the future of smart home technology.
Sustainable Semiconductor Manufacturing: A Mid-Year Roundup of 2024 Top Developments
Explore the top five sustainable semiconductor developments of 2024, highlighting how industry leaders are innovating to meet environmental, consumer, and investor demands.
KIOXIA/WD BiCS8 218L CBA 3D TLC NAND
Discover the latest Hybrid Bonding technology with the KIOXIA/WD BiCS8 CBA 3D TLC NAND. Analyzed by TechInsights, this innovative device showcases an advanced edge-XDEC floor plan and a sophisticated 2-deck integration.
Samsung SF3 (2nd Gen 3nm GAA) in Exynos W1000 Processor Confirmed
Initial SEM results confirm Samsung’s 2nd generation 3nm GAA technology in the Exynos W1000 processor. Discover key insights and implications for high-volume manufacturing requirements in our latest analysis on the TechInsights Platform.
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