This report presents a Memory Floorplan Analysis of the Micron F57R die found inside the Micron MT44K32M36RCT-125 package.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
• Plan-view SEM micrograph of the memory array delayered to active, WL, and BL layers
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to the polysilicon layer
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in CircuitVision
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process