This report presents a Memory Functional Analysis of the Micron Z11C die found inside Micron MT40A1G8SA-075:H package. The MT40A1G8SA-075:H package was extracted from the Micron MTA8ATF1G64AZ-2G6H1 DDR4 SDRAM UDIMM.
This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) cross-sectional micrographs through the bit line (BL) showing the general structure of the DRAM cell array, die dielectric materials, and major features
• SEM bevel through the memory array showing the active, bit, and word line level plan-view features
• Plan-view optical micrograph of the die delayered to the polysilicon layer
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software