Annual global handset shipments continued to improve in Q1 2024. Despite economic pressure on consumers, war in Europe, and other disruptions consumers opened their wallets in the first quarter of 2024 to purchase new handsets.

The Baidu Kunlun processor is China’s first domestically produced AI accelerator IC which features thousands of cores providing up to 260 trillion operations per second (TOPS) and 512 GB/s memory bandwidth to two second generation high bandwidth memory (HBM2) totaling 16GB of in package memory.

This report presents key DC electrical characteristics for logic NMOS and PMOS transistors located in the CPU1 region of the MediaTek AHJ11236C die found inside the MediaTek MT6989W Dimensity 9300 application processor.

This market forecast highlights the impact that vehicle architecture change and electrification are having on automotive electronics system demand. Key changes in this update include a substantial upgrade to the forecast model for new vehicle architectures, with High Performance Compute Platforms now included. This update also sees a slowing in the predicted growth for battery electric vehicles.

Discover insights into the transformative chiplet market within the computing sector. Gain a nuanced understanding of evolving standards, ecosystem dynamics, and projected growth trajectories.

The ZTE Blade A73 5G features a 90Hz, 6.52-inch IPS LCD display with a resolution of 720 x 1600 pixels. The phone is powered by Unisoc’s T760 chipset with an octa-core CPU. It comes with 4GB of RAM and 128GB of internal storage, expandable via microSDXC.

Sony's image signal processor (ISP) die from Sony's 1.8 MP, 1.5 μm pixel pitch, stacked back-illuminated CMOS image sensor (CIS) was extracted from the Apple Vision Pro Headset (A2117) IR eye tracking camera. The Apple Vision Pro Headset (A2117) IR eye tracking camera measures 8.8 mm ×5.8 mm ×5.0 mm thick. It contains a stacked imager comprising a CIS die and an ISP die.

The April Update provides The McClean Report’s ranking of the top-50 semiconductor suppliers of 2023 by sales revenue, by growth rate, and by headquarters location. The top-10 semiconductor suppliers of 2023 are compared with the top-10 from 10, 20, and 30 years ago.

The FH513_4KN4 RF power amplifier die was extracted from the Avago AFEM-8234 MHB L-PAMiD RFFE module. This RFIC process analysis (RFP) was performed on samples removed from the Apple iPhone 15 Pro 5G smartphone (A2848) smartphone.

This presentation provides an overview of the Sensor Market and covers the market and vendor highlights for Smartphone Image Sensors, Smartphone Fingerprint Sensors and Automotive Image Sensors in 2023.