Handset shipments in the United States declined year-on-year in Q1 2024. Apple led across major carriers, followed by Samsung, which led Android, and then by Motorola, and TCL-Alcatel. Verizon Wireless was the standout operator. This extensive report tracks mobile handset shipments and vendor market share for major vendors at the "Big 3" operators in the United States on a quarterly basis from Q1 2009 to Q1 2024.

Apple global iPhone shipment decreased 11% annually during Q1 2024, underperforming overmarket which went up 10% YoY. iPhone 15 Pro Max topped the chart this quarter, followed by iPhone 15 Pro and 15. iPhone 14 Pro Max and iPhone 15 Plus ranked the top 5 list too. This report details global shipments for every iPhone model since its launch through Q1 2024, from the iPhone 2G to the iPhone 15.

Internally operators have already begun to leverage Gen. AI to automate not only administrative tasks, but also new use cases for network optimization and problem resolution with ‘domain specific’ LLMs (Large Language Model) for their own use. And externally, Gen AI. Use cases for customer self-care, enhanced service operations and secure access authentication are already reducing telecoms operating costs.

HP continues its design tradition of using an aluminum enclosure fitted to all internal components. Samsung provides a 16-inch 3840x2400 pixel OLED Display with a multitouch Touchscreen. The brightness of that display is 400 nits. Dimension is 351.80 x 233.4 mm with a weight of 334.4 grams. The stylus is charged by USB Type-C. The total weight is 14.5g. The stylus is a part of the laptop and is included in the box.

This report forecasts global demand for Ultra High Definition 4K and 8K TVs across 6 regions and 88 countries from 2014 to 2029. The report provides historical and forecast data for total Ultra High Definition TVs split by 4K and 8K.

This workbook provides a forecast on public cloud demand in terms of hours of consumption. It also translates hourly consumption into the equivalent number of processors and accelerators sold by cloud providers, and the minimum shipments required by cloud providers to sustain demand.

Intel Core Meteor Lake (Intel4) I/O Die Digital Floorplan Analysis Share This Post The SRMZ1 is a 3D packaging assembly comprising a side-by-side arrangement of four dies, including an input/output (I/O) die with die makings 8PNVC, mounted on a common interposer placed on the package wiring board

This report is based on the reverse engineering results developed by TechInsights and coupled with the knowledge and expertise of TechInsights’ subject matter experts. It includes publicly available information and discussed to help better understand the process and focuses only on devices fabricated by TSMC.

Analysis of the process flow and integration used in the manufacture of the Renesas automotive microcontroller R7F702301BEBBA-C_BC6 comprising a Renesas R7F702301B die, built in TSMC 28 nm embedded flash memory technology. The spreadsheet lists the hundreds of process flow steps required in its manufacture.

The surge in enterprise cloud adoption and the growing demand for GPU-accelerated computing has presented a golden opportunity for smaller, GPU-focused cloud providers. The goal of these so-called GPU Cloud providers isn’t to replace cloud hyperscalers; instead, they aim to complement them within enterprises’ multi-cloud strategies.