In this presentation we will survey the different GaN integration strategies that we have observed in recently procured USB adapters. It is believed that GaN brings compelling advantages in terms of efficiency for adapter and other power supply products; however, achieving these efficiencies in a cost-effective manner can be challenging.

So far, NAND Flash has shown a white-hot stage. Not long ago, storage vendors were still "seeing the scenery on the high platform of flash memory" with 128 layers.

Memory Technology 2020 and Beyond NAND, DRAM, Emerging and Embedded Memory Technology Trends This webinar was presented by TechInsights In this webinar, Dr. Jeongdong Choe will present his detailed review of the latest NAND, DRAM, emerging and embedded memory technologies, summarized from reverse

The information presented in this webinar will be of greatest interest to those looking to understand the semiconductor design wins of the iPhone 12, and related financial implications to companies like Qualcomm, Broadcom, Skyworks, Qorvo, Cirrus Logic, Dialog Semiconductor, and more.

How SEMulator3D can be used to study micro loading and manufacturing variability in an advanced DRAM process that exhibits a wiggling AA profile.

This presentation will examine some of the different structures we have seen through the evolution of these technologies, in particular the latest 3D-NAND and DRAM parts. We will also look at several historical applications of ALD/ALE technology that have been observed through reverse engineering.

The evolutionary history of the iPhone camera can also be seen as the history of the development of the phone CIS, even if the iPhone does not fully follow the CIS technology trends to advance. Just take this opportunity, but also through the last two articles to review the modern mobile phone

During this 30-minute presentation our experts will provide exclusive insight of our findings on the latest 5G mmWave transceiver architecture with a focus on the solution, including the QTM052 Antenna module from Qualcomm.

SK hynix has released the world’s first 128-layer (128L) 3D NAND, which they have termed 4D NAND. This is their second NAND generation built using Periphery Under Cell (PUC) architecture; the first was their 96L NAND. In PUC architecture, peripheral circuits are stacked under the cell, resulting in