Fewer Find 3nm Worth the Wait
TSMC and Samsung have suffered lengthy delays in their 3nm processes, and the gain in density and other characteristics is smaller than in previous nodes. Intel says its future nodes are on schedule.
The EPC 2152 – A Fully Integrated GaN Half-Bridge IC
TechInsights comments on what the main reasons for this integration are, other innovations throughout the GaN die, and how there is not a ‘one size fits all’ approach in regard to power semiconductor devices.
SemiWEEK: SEMI ISS Takeaways Continued; Supply-chain clouds are still hanging over the industry; Stocks were mixed
Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.
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Pat Gelsinger Takes us on a Trip Down Memory Lane – and a Look Ahead
Dick James, a Senior Fellow and Technology Analyst with TechInsights, entered the semiconductor industry in 1970, working for Philips Semiconductor. In this blog, he presents a retrospective of gate technology, ranging from 1971’s 10-micron design rules (!) through to the more modern 5-nanometer.
Component Pricing Landscape and Analysis
TechInsights brings together unique industry insight gained from over 20 years of experience in performing teardowns in some of the highest volume applications combined with crowd-sourced pricing data from companies. Data science algorithms are used to make sense of this data to establish up to date market pricing curves for each manufacturer part number (MPN).