This report provides an analysis of the floorplan design used in the SunLune Technology Jasmier X4 Ethereum Miner ASIC, fabricated on the XMC 40nm CMOS process, which incorporates DRAM DBI interconnect and includes an executive summary and supporting image sets SEM cross sectional and bevel imaging sets.

This quick look report provides insight on the advanced packaging innovations used in the manufacturing of the MediaTek MT6985W Dimensity 9200 Processor, using TSMC's InFO-B process.

SEMICON West Highlights G. Dan Hutcheson The Chip Insider® Summary: SEMICON West Highlights: Downturn Shock: Zombie-land facial expressions were characteristic of this year’s show. Back in December, few believed us when TechInsights analysts forecasted a 16% drop in WFE… Applied Materials’ strategic

The recent extreme climate events worldwide have increased the focus on the importance of environmental sustainability.

The HTC Vive Elite XR is HTC’s latest VR Headset which doesn’t require a base station. This model features five cameras instead of six as in the HTC Vive Cosmos.

The GMC Sierra is a full-size pickup truck manufactured by GMC (General Motors Truck Company). The Harman INFO 3.7-3.8 CSM is an infotainment system developed by Harman, a global technology company specializing also in automotive solutions.

NXP’s i.MX91 addresses simple edge applications with a feature subset of the i.MX93, maintaining pin compatibility and reducing power.

TechInsights’ floorplan analyses of smartphone processors reveal the size of CPUs and caches.

This report provides a deeper insight on the advanced packaging innovations used in the manufacturing of the nVIDIA Hopper GH100 GPU.

Qualcomm’s Snapdragon 4 Gen 2 offers more-powerful CPUs and faster DRAM than MediaTek’s Dimensity 6100+, but neither new chip delivers much improvement to low-cost smartphones.