TechInsights Teardown Reveals Apple iPhone Air A3260 Costs 2% More Than Galaxy S25 Edge

Teardown insights show how Apple’s design choices and component strategy push the iPhone Air A3260 slightly above Samsung’s Galaxy S25 Edge in overall cost.

  3 Min Read     December 1, 2025

Apple iPhone Air Teardown

TechInsights has released its teardown of the Apple iPhone Air A3260, identifying 29 new components and revealing that the device’s total estimated cost is 2% higher than Samsung’s Galaxy S25 Edge. The full teardown video is available exclusively to TechInsights subscribers, as well as the deep dive teardown report.

The US-purchased iPhone Air features a Hexa-Core Apple A19 Pro processor, 12 GB LPDDR5X DRAM, 256 GB of 3D TLC NAND, and a 6.53-inch AMOLED display with over a billion colors. The handset supports WiFi 7, Bluetooth 6.0, UWB, NFC, MSS, GPS, and USB Type-C, and uses a premium enclosure made from aluminum, titanium, stainless steel, plastic, and glass.

Processor and RF Components Drive Costs

The A19 Pro accounts for 18.63% of the total BOM, the largest cost contributor. By comparison, the Snapdragon 8 Elite in Samsung’s S25 Edge represents 28.03% of that device’s BOM. RF components are also a major factor in the iPhone Air, though still lower in cost and percentage impact than Samsung’s.

Camera and Sensor Costs Lower Than Samsung’s

The iPhone Air’s camera subsystem represents 15.47% of the BOM, lower than the camera cost share in the Galaxy S25 Edge. Sensor and RF subsystem costs are also lower for Apple, giving it efficiency advantages in several electronic categories.

Connectivity and Enclosure Costs Run Higher

The teardown shows higher connectivity costs for the iPhone Air compared to Samsung’s device, reflecting Apple’s investment in WiFi 7 and advanced UWB capabilities.

Non-electronic costs are also higher overall, with the main enclosure accounting for 81.87% of Apple’s non-electronic BOM, driven by its multi-material aluminum–titanium construction.

Overall Findings

TechInsights identifies the Applications Processor and RF components as the largest contributors to the iPhone Air’s BOM. Despite cost increases in enclosure and connectivity, Apple maintains cost advantages in sensors and RF subsystems.

Apple A19 Pro

For full component-level analysis and cost modeling, subscribers can access the complete teardown report on the TechInsights Platform.

TechInsights Platform Subscribers can access the full iPhone Air A3260 teardown report immediately.

 

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