TSMC 4NP Process Technology (NVIDIA variant) Process Analysis

 

  2 Min Read     November 24, 2025

 
 

This report analyzes the NVIDIA Blackwell HGX B200 GPU die's structure and materials, detailing fabrication methods and in-depth materials analysis.

TSMC 4NP Process Technology (NVIDIA variant) Process Analysis

This report provides an analysis of the structure and materials used in the manufacture of the NVIDIA Blackwell HGX B200 GPU die, fabricated by TSMC using the 4NP NVIDIA custom FinFET process. The report includes a summary of key findings and a detailed look at the FEOL, MOL, and BEOL structures and materials used. Extensive SEM, TEM, and materials analysis provide a complete look at how this device was manufactured.

This summary outlines the analysis* found on the TechInsights' Platform.

*Some analyses may only be available with a paid subscription.

 

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