Narrative: Packaging Substrates – Q4 2025 – Glass and Panels Energizing the Market

Explore how panel-level and glass substrates are reshaping advanced packaging and driving semiconductor demand through 2030.

Manufacturing Analysis: Advanced Packaging Demand Forecast Synopsis: This report explores the shift in semiconductor packaging toward panel-level packaging, advanced substrates, and glass substrates. It analyzes how these technologies enable higher performance, greater integration, and cost efficiency for AI, HPC, and 3D architectures. The report highlights manufacturing challenges, supply chain pressures, and strategic investments reshaping the industry. It also provides a demand forecast through 2030, revealing how PLP is scaling rapidly, while glass and other advanced substrates promise to disrupt traditional interposers.