CXMT CDTQ G3 12 Gb LPDDR5 DRAM Memory Floorplan Analysis
2 Min Read August 1, 2025
Memory Floorplan Analysis of CXMT’s CDTQ LPDDR5 DRAM in Huawei Nova 13 Pro reveals 12Gb dies on G3 process in POP MCP package.
A Memory Floorplan Analysis (MFR) of the CXMT CDTQ DRAM die found inside CXMT CDTQ packages. The CDTQ package was extracted from Huawei Nova 13 Pro MIS-AL00 5G cell phone. The CDTQ LPDDR5 package is a BGA multi-chip package (MCP) at the bottom of package-on-package (POP). The The CDTQ package contains eight 12 Gb LPDDR5 DRAM dies, fabricated using CXMT G3 process, the third generation of CXMT DRAM process.
