2 Min Read July 17, 2025
This report reviews both top-line and segmented annual units shipped from top OEMs. It's broken down by: Lithography, CMP, Ion Implant, Deposition, Etch, Clean, and Process Diagnostics.
Huawei Matebook Fold Uses Kirin X90 Built on SMIC’s 7nm (N+2) Node
TechInsights confirms Huawei's Matebook Fold | Ultimate Design features the Kirin X90 SoC built on SMIC’s 7nm (N+2) process—debunking rumors of a breakthrough 5nm node.
Stay informed on the latest shifts in semiconductor policy, AI, packaging, and market dynamics in the June 2025 Chip Observer, featuring insights on Qualcomm, OpenAI, Huawei, and more.
US Tariffs and Taiwan Curbs Reshape Semiconductor Supply
Trump’s tariff threat and Taiwan’s export curbs on Huawei and SMIC add new risks and delays to global semiconductor supply chains and chip manufacturing plans.
