Xiaomi Xring 01 SoC Floorplan Analysis

Explore the Xiaomi Xring O1 chip, built on TSMC’s N3E node with 10-core CPU & 16-core GPU. See full teardown, layout, and cost analysis.

The Xiaomi Xring O1 chipset that is self-developed the system-on-chip (SoC) for this newest edition to their Xiaomi 15 series by Xiaomi replaces the Qualcomm Snapdragon 8 Elite processor chipset found in Xiaomi's previous generation flagship phone, the 15 Pro. The Xiaomi Xring O1 die was manufactured on 300-mm wafers, by TSMC, using TSMC's 2nd generation 3 nm (N3E) process, and BEOL features a total of 17 metal interconnection layers, including 16 levels of copper (Cu) filled layers and a top aluminum (Al) layer used as the terminal metal (TM).The Xiaomi Xring O1 contains a 10-core CPU architecture and a 16-core Immortalis-G925 GPU. This analysis includes node identification, BEOL stack, bit cell usage, critical dimensions, and digital blocks layout with die utilization calculations for total area for logic, I/O memory, and analog components separately. Manufacturing cost is also provided