Qualcomm BI54 ultraSAW die (QPM8590-002) Acoustic Wave Filter Report

Discover the first observed Qualcomm module combining LB and MHB front-end in one—featuring detailed analysis of the BI54 ultraSAW filter from the Xiaomi 15 Pro.

This report analyses the temperature compensated surface acoustic wave filter (TC-SAW) die marked "BI54" from the Qualcomm QPM8590-002, which was extracted from the Xiaomi 15 Pro (2410DPN6CC) mobile handset from China.

The QPM8590-002 is a Low-Band (LB), Mid-Band/High-Band (MHB) Radio Frequency Power Amplifier Module with LNA and integrated duplexers (L-PAMiD) developed for 4G LTE and 5GNR applications. It represents the first module observed by TechInsights that combines the functionality of the LB and MHB front-end into a single module.