Qualcomm Snapdragon 8 Elite SM8750 Processor TSMC N3E FinFET Process 4.9-Track Height CPU Library

This report analyzes the BHJ11357B die in Qualcomm’s Snapdragon 8 Elite SM8750, detailing GPU1 area, FINFLEX structure, and digital cell design.

This report presents a SoC Design Analysis of the BHJ11357B processor die found inside the Qualcomm Snapdragon 8 Elite SM8750 package-on-package (PoP) application processor assembly. The total analyzed GPU1 area is 5,925 µm2.. The GPU1 library uses a 2-1 fin FINFLEX standard cell library, using a repeat pattern of a track of 2x2 fins followed by a track of 1x1 fins. This analysis includes the majority of digital library cells, the structure of metal power rails, and routing efficiency.