Samsung Exynos 2400 Advanced Packaging Analysis
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The Exynos 2400 processor was extracted from the Samsung Galaxy S24+ global model and is co-packaged with a 12 GB Samsung LPDDR5X DRAM memory device. The memory over processor package-on-package (PoP) assembly uses Samsung’s fan-out wafer level package (FOWLP) technology which is the newest entry to Samsung’s 2D fan-out package (2D FOPKG) platform for use in mobile and wearable devices. On their website, Samsung claims the 2D FOPKG technologies can provide smaller form factors compared to simple flip-chip packaging, thinner profiles by eliminating top and bottom substrates, and improved thermal performance. FOWLP technology was preceded by fan-out panel level package (FOPLP) technology which TechInsights has analyzed in past reports. The Exynos 2400 processor is the first time Samsung has adopted FOWLP packaging technology for a processor in a handset and competes with TSMC’s InFO-B PoP technology which is on TechInsights roadmap for future analysis.
This report provides deeper insight on the advanced packaging innovations used in the manufacturing of the Samsung Exynos 2400 processor. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance or thermal management.
