Analysis of the floorplan design used in the Micron Technology MT62F1536M64D8ZA-023 (Y5BP Die) D1β 12 Gb LPDDR5X and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets. Process node and foundry identification, critical dimensions, memory and periphery functional block summaries and die/package cost analysis are provided.
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