The Memory 3D NAND technology roadmap has been updated. Industry leading 3D NAND companies such as Samsung, SK hynix, Micron, Solidigm, KIOXIA, Western Digital, YMTC, and MXIC have their own plan for the future of high-speed and high-density storage applications. Upcoming new and advanced 3D NAND technologies including multi-stacking, hybrid bonding, and package solutions are also described on the roadmap.
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