Baidu Kunlun1-T AI Processor with Samsung I-Cube 2.5D Package Technology Advanced Packaging Analysis
Share This Post
The Baidu Kunlun processor is China’s first domestically produced AI accelerator IC which features thousands of cores providing up to 260 trillion operations per second (TOPS) and 512 GB/s memory bandwidth to two second generation high bandwidth memory (HBM2) totaling 16GB of in package memory. The Kunlun AI accelerator is packaged using Samsung’s I-CubeS variant of the interposer cube (I-Cube) 2.5D packaging technology which uses a silicon (Si) interposer to interconnect the two HBM2 memory packages and the AI processor die. This differs from Baidu’s 2nd generation Kunlun Xin A2S1CAXGA processor which was packaged as a single die flip-chip bonded onto a printed wiring board.
