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Over 3,200 Reports
Published in the last 12 months
Over 100,000 Chipsets
Reverse engineered to date
Huawei Mate 80 Pro Max Teardown Confirms Kirin 9030 Pro on SMIC N+3
TechInsights’ teardown of the Huawei Mate 80 Pro Max confirms the Kirin 9030 Pro on SMIC’s N+3 process and reveals major upgrades in display, cameras, and connectivity.
2026 Advanced Packaging Outlook Report
Discover the five expectations defining advanced packaging in 2026, including CPO adoption, HBM4 demand, panel and glass scaling, 3D thermal challenges, and chiplets for mobile.
Trump Approves H200 Exports: Impact on NVIDIA, TSMC & HBM
Trump’s approval of H200 exports to China could reshape GPU, packaging, and HBM markets. TechInsights analyzes supply constraints, pricing, and $40–50B demand.
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