Broadcom BCM4398 Wi-Fi 7/BT 5.2 Combo SoC Floorplan Analysis (IoTB)
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This report is a Basic Floorplan Analysis (BFR) of the Broadcom BCM4398 die found inside the Universal Scientific Industrial G5-602550 component. The BCM4398 die was manufactured on 300 mm wafers using TSMC's 7 nm HKMG finFET CMOS process. It features 17 metal interconnect layers (1 aluminum (Al) top layer, 16 copper (Cu) layers). The minimum observed metal, contacted gate, and fin pitches of 40 nm, 57 nm, and 30 nm, respectively.
