Deep Dive Teardown of the Samsung Galaxy Z Flip5 SM-F731N Smartphone
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Qualcomm has the most design wins for the Samsung Galaxy Z Flip SM-F731N, supplying 14 of the 42 major designs. It is the first time TechInsights has analyzed the following components: Multichip Memory -8 GB Mobile LPDDR5 SDRAM Samsung #K3KL3L30CM-BGCU, Multichip Memory -512 GB 3D TLC V-NAND Flash, Memory Controller (UFS 4.0) Samsung # KLUFG8RHHD-B0G1, 7 A Switched Capacitor Battery Charger NXP Semiconductors #PCA9482UK, MEMS Pressure Sensor STMicroelectronics #LPS22DF and RxD Front-End Module Wisol #SFML2Axxxxx. The phone supports WiFi 6e/Bluetooth 5.2 using Qualcomm #WCN6856-102, using 2 x 2.4 GHz WiFi Front-End NXP Semiconductors #WLAN7207H and 2 x 5 to 7.2 GHz WiFi Front-End Module Qualcomm #QXM1086. Two antennas located in the Main Enclosures (NE#2 Upper Main Frame) are used for communication: WiFi 1/GPS L1 Antenna and WiFi 2/Main 4 Antenna.
