AMD Ryzen 9 7950X3D TSMC SoIC Package Technology Advanced Packaging Analysis

AMD Ryzen 9 7950X3D TSMC SoIC Package Technology Advanced Packaging Analysis

 
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This report provides a deeper insight on the advanced packaging innovations used in the manufacturing of the AMD Ryzen 9 7950X3D (second generation 3D V-Cache). The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance.

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