The Advanced Memory Essentials (AME) deliverable for NAND flash chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the in-depth image folders. The AME deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.

The in-depth image folders will contain the following:

• Downstream product teardown images
• Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
• SEM bevel through the logic region and NAND flash SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
• Two TEM cross sections, orthogonal to the word and bit lines, showing the NAND flash array cells, the lower metals and dielectrics, transistor gates, isolation, and other FEOL feature

The results of TEM-EDS analyses are included in the AME summary document.