HiSilicon Kirin 8020 - Hi62B0 Advanced Packaging Quick Look

Explore the HiSilicon Hi62B0 package in the Huawei Nova 14 Pro/Ultra, featuring FCBGA and advanced PoP memory technology in a compact design.

This is an Advanced Packaging Quick Look (APQ) summary for the HiSilicon Hi62B0 package and the memory package found within the Huawei Nova 14 Pro/Ultra handset. The HiSilicon Hi62B0 package is a flip chip ball grid array (FCBGA) and part of HiSilicon's Kirin 820 series [1]. The HiSilicon Hi62B0 includes System-on-Chip (SoC) die. The memory package comprises two multi-chip ball grid array (BGA) packages stacked using Package-on-Package (PoP) packaging technology.