2 Min Read August 13, 2025
A Basic Floorplan Analysis of the power management IC Qualcomm HG11-27204200 die found inside the Qualcomm PM8550VE-001 component, which was extracted from the Motorola Edge+ 2023 smartphone.
AI Model Trends Q3 2025: Small Models Surge as Total Count Doubles
TechInsights projects over 2.5M AI models in 2025, nearly doubling year-over-year, with small models and multimodal AI driving the next wave of innovation.
Explore August chip market trends—tariffs, manufacturing shifts, AI momentum, and key investments—in TechInsights’ latest semiconductor analysis.
Inside the Future of Wearables | Teardown Insights & Market Trends eBook
Discover what's powering next-gen wearables. Get teardown insights, sensor trends, and strategic analysis in our free TechInsights eBook—built for tech leaders.
