Qualcomm Snapdragon Ride Platform (SA8650P) Floorplan Quick Look Analysis

Explore the Qualcomm SA8650P—our floorplan analysis highlights Oryon CPUs, Adreno GPUs, and Hexagon NPUs on Samsung’s 5nm FinFET process.

The Qualcomm HG11-30205-2 die found inside the Qualcomm SA8650P package and it was removed from the Hongqi advanced driver assistance systems (ADAS) controller. The Qualcomm HG11-30205-2 die was fabricated on 300 mm wafers by Samsung using the 5 nm (5LPE) FinFET high-k metal gate (HKMG) CMOS process with a 27 nm minimum fin pitch and 36 nm minimum metal pitch (M2). It features Qualcomm Oryon CPU cores, Adreno GPU and Hexagon NPU cores.