Huawei Matebook Contains Kirin X90, using SMIC 7nm (N+2) Technology
Huawei’s Latest Laptop Pushes Ecosystem Independence, But SMIC’s Process Technology Still Lags Behind Global Leaders
5 Min Read June 23, 2025
TechInsights confirms Huawei's Matebook Fold | Ultimate Design features the Kirin X90 SoC built on SMIC’s 7nm (N+2) process—debunking rumors of a breakthrough 5nm node. Read the full analysis to understand the implications for China’s semiconductor roadmap.
Despite the rumours around Huawei’s Matebook Fold | Ultimate Design’s new X90 SoC possibly being manufactured using a breakthrough SMIC 5nm-equiavalent (N+3) process, TechInsights can confirm that it was manufactured using SMIC’s 7nm (N+2) process node. It was August 2023 that TechInsights found the first commercial instance of the SMIC’s 7nm (N+2) in the Huawei Mate 60 Pro. Almost two years later, SMIC’s 5nm (N+3) process node remains elusive.
With the laptop’s launch in May 2025, a lot of attention was drawn to it being Huawei’s first homegrown laptop hardware and its own Harmony OS-powered operating system (HarmonyOS 5). It represents a clear step towards Huawei’s independent hardware-software future with less reliance on non-domestic sources, more control, and focusing on China-first innovation. This launch demonstrates Huawei’s most aggressive entrance into full-stack computing: chip design, OS development, and hardware integration. Reacting to U.S. sanctions, Huawei continues to pursue stronger self-reliance since 2019, aiming to reduce dependency on Intel chips and Microsoft’s Windows OS.
While Huawei did not explicitly state that the new PC included an advanced node, the industry was ripe with rumours that this device did promote the idea that it could include SMIC’s 5nm (N+3) technology node. With the device still manufactured using its N+2 process, this likely means that SMIC has not yet achieved a 5nm equivalent node that can be produced at scale.
This news points to the fact that U.S.-imposed technology controls are likely continuing to impact SMIC’s ability to catch-up to current foundry leaders in more advanced nodes across chips for mobile, PCs, and cloud/AI applications.
With limited access to a variety of equipment, including extreme ultraviolet (EUV) lithography, China-based foundries remain challenged to deliver advanced nodes – having to rely on multi-patterning which leads to yield challenges as the node size is reduced.
The Huawei Matebook Fold | Ultimate Design is a strategic statement – that Huawei is prepared to challenge Apple (with macOS and M-chips) and Microsoft (Windows/Intel/AMD) by offering a cohesive, sovereign ecosystem. However, at the chip fabrication level, the gap continues to widen. If Huawei is stuck on a 7nm equivalent SoC, it is multiple generations behind the likes of Apple (M3 and M4 series), AMD (Ryzen 8040 series), and Qualcomm (Snapdragon X Elite series). TSMC, Samsung, Intel, and Rapidus will all make 2nm processes available to customers in the next 12 to 24 months, widening the gap between China’s process technology and the rest of the world by at least three technology generations.
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