Is there a Sustainable Choice for Future On-Die Interconnect Metals?
As copper reaches its limits, the search for next-gen on-die interconnects turns to molybdenum and ruthenium. Are they the future?
One impact of continued transistor scaling is narrowing of metal linewidths at a closer proximity. The search for the next generation of on-die metal interconnects is underway to. Copper has been a stalwart for the industry for decades but is finally reaching the end of the road, more attention is being given to alternatives such as molybdenum and ruthenium. Is any choice truly sustainable? Can the impact of more advanced processing techniques be mitigated?
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