Leveraging TechInsights' array of technical analysis and cost models to gain valuable insights into advanced packaging and interposer technologies

The Challenge

This organization develops products that enhance high frequency and high voltage use in low-voltage transistor applications, essential for Data Centers, AI, High Performance Computing (HPC), and mobile applications requiring low quiescent current. Large global IDMs have already incorporated the organization’s technology into their products.

The business is now exploring the opportunity to help customers having advanced SoC design teams incorporate its next generation enabling technology into those advanced designs. The business sees high growth potential in helping those companies improve Power, Performance, Area, and Cost (PPAC) and sees significant ROI upon adoption of its technology solutions. To achieve this, it must understand how its new technology intersects advancements in high density interconnect technologies and high-density logic in SoC design. The organization’s goal is to identify which products and designs would benefit from its technology adoption, show a compelling ROI, and improve its PPAC while enabling more design flexibility.

How TechInsights Can Help

TechInsights offers four key products that helped the organization assess its opportunities. First, Advanced Packaging provided the business with insights into emerging interposer technologies used in advanced SoCs. Second, Compute enabled the analysis of designs, standard cell library implementations, die sizes and filler cell usage in major logic IP blocks, particularly CPU and GPU cores, informing the businesses’ decisions on technology implementation intersection points and potential ROI for their customers when adopting their newest technology. Third, TechInsights’ High Performance Computing covers the most advanced interconnect technologies crucial for AI and HPC applications, which would benefit from a reduction in their high power and cooling needs. Finally, Semiconductor Manufacturing Economics’ Strategic Cost Models allowed the organization to perform sensitivity analysis and develop a strong ROI business case to present to potential customer candidates to adopt their technology, helping it evaluate how its solutions can drive return on investment for potential customers. These tools helped guide the business in refining its technology strategy and identifying high-value opportunities.

The Results

By integrating TechInsights' products, the organization gains valuable insights into advanced packaging and interposer technologies, and TechInsights’ comprehensive analysis of logic IP blocks and high-performance computing insights that helped the company refine its offerings for AI, HPC, and mobile applications, addressing power and cooling inefficiencies that could reduce operational costs for clients, especially in data centers.

The company was able to identify the SoCs realizing the largest benefit from relocating and reducing on-chip filler cells off-chip, allowing a demonstrable ROI to their potential client. This led to faster adoption of their technology and improved PPAC metrics for their clients. TechInsights content enabled fast diligence, and lead customer identification based on the ROI their client could realize. This reduced time-to-money by allowing the company to present a compelling ROI to their clients and accelerate market entry.

Finally, by utilizing Semiconductor Manufacturing Economics Strategic Cost Models, the company can optimize pricing strategies and build a strong ROI case, quantifying potential savings of more than $10M in cost of ownership due to PPAC gains. This not only reduced risks of targeting the wrong potential client but improved operational efficiencies and set the stage for market penetration, accelerated market growth to position the company as a differentiator in power-efficient solutions.