Sony IMX816 (0.60 µm) Device Essentials Plus
Discover the advanced structure of Sony's 50 MP IMX816 CIS—explore detailed insights into its foundry, fabrication, and features extracted from Honor 100 Pro’s front camera.
The Sony IMX816 is a 50 MP 1/2.93” format Exmor RS stacked back-illuminated (BI) CMOS image sensor (CIS) with a pixel pitch of 0.60 μm. The IMX816 was on the TechInsights’ roadmap as the first 0.60 μm pixel from Sony. This report provides an extended insight into the structure of the Sony IMX816 CIS extracted from Honor 100 Pro front camera. The analysis provides foundry identification and details of the fabrication process used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed.
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